Normally fragile and brittle silicon chips have been made to bend and fold, paving the way for a new generation of flexible electronic devices.
Completely integrated, extremely bendable circuits have been talked about for many years but have not been demonstrated before
The complex devices consist of concertina-like folds of ultra-thin silicon bonded to sheets of rubber.
Writing in the journal Science, the US researchers say the chip’s performance is similar to conventional electronics.
The stretchy circuits could be used to build advanced brain implants, health monitors or smart clothing.